Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Development and evaluation of lead free reflow soldering techniques for the flip chip bonding of large GaAs pixel detectors on Si readout chips
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Klein, M.; Hutter, M.; Oppermann, H.; Fritzsch, T.; Engelmann, G.; Dietrich, L.; Wolf, J.; Brämer, B.; Dudek, R.; Reichl, H. | IEEE Components, Packaging, and Manufacturing Technology Society; Electronic Components, Assemblies, and Materials Association:
58th Electronic Components and Technology Conference 2008. Proceedings. Vol.4 : Lake Buena Vista, FL, 27 - 30 May 2008
Piscataway/NJ: IEEE, 2008
ISBN: 978-1-4244-2230-2
pp.1893-1899 |
| Electronic Components and Technology Conference (ECTC) <58, 2008, Lake Buena Vista/Fla.> |
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| English |
| Conference Paper |
| Fraunhofer IZM () |