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Breakthroughs in chip embedding technologies leading to the emergence of further miniaturised system-in-packages

 
: Manessis, D.; Böttcher, L.; Ostmann, A.; Karaszkiewicz, S.; Reichl, H.

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4th IMPACT Conference & International 3D IC Conference 2009. Proceedings : 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference SIPO International 3D IC Conference; October 21-23, 2009; Taipei Nangang Exhibition Hall; Taipei, Taiwan
Piscataway, NJ: IEEE, 2009
ISBN: 978-1-424-44341-3 (online)
ISBN: 978-1-4244-4342-0
pp.174-177
International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) <4, 2009, Taipei>
International 3D IC Conference <2009, Taipei>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-115305.html