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Assembly of pressure sensor chips as an example for integrated MEMS for high temperature applications

: Klieber, R.; Goehlich, A.; Trieu, H.-K.; Kappert, H.; Grabmaier, A.

Verband der Elektrotechnik, Elektronik, Informationstechnik -VDE-; Bundesministerium für Bildung und Forschung -BMBF-, Deutschland; VDI/VDE Innovation+Technik, Berlin:
MikroSystemTechnik Kongress 2009. Proceedings. CD-ROM : 12. - 14. Oktober 2009, Berlin
Berlin: VDE-Verlag, 2009
ISBN: 978-3-8007-3183-1
Paper P1.21
MikroSystemTechnik Kongress <2009, Berlin>
Conference Paper
Fraunhofer IMS ()
MEMS; high temperature; pressure sensor; encapsulation

Fast decrease of device dimensions, rapid growth of the number of elements per integrated circuit device (IC) and the
increasing amount of interconnections between the chip and the PCB lead to a more complex design and production of
the ICs and to higher demands towards packaging technology as well. This is especially true in the field of high temperature electronics, with operating temperatures up to 250°C for example within automotive, geothermal wells, aerospace, space and nuclear power applications. For this temperature range we present an evaluation of materials for packaging of high temperature ICs, a high temperature capable pressure sensor as an example for an integrated MEMS and its temperature dependence.