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Improvement of the adhesion of a galvanic metallization of polymers by surface functionalization using dielectric barrier discharges at atmospheric pressure

: Borris, J.; Dohse, A.; Hinze, A.; Thomas, M.; Klages, C.-P.; Möbius, A.; Elbick, D.; Weidlich, E.-R.


Plasma Processes and Polymers 6 (2009), No.S1, pp.S258-S263
ISSN: 1612-8850
ISSN: 1612-8869
International Conference on Plasma Surface Engineering (PSE) <11, 2008, Garmisch-Partenkirchen>
Journal Article, Conference Paper
Fraunhofer IST ()
dielectric barrier discharge; plasma activation; plasma amination; plastic metallization; plasma printing

An environmentally friendly plasma amination process for the activation of polymers prior to electroless metallization using dielectric barrier discharges (DBD) at atmospheric pressure was investigated. One focus of the work was on the correlation between plasma parameters and palladium coverage on the polymer on the one hand and the palladium coverage and adhesion of a galvanic copper metallization on the other hand. Using XPS spectroscopy it was found that a DBD treatment of polyimide (PI) films with mixtures of N2 and H2 leads to considerably higher Pd surface concentrations than on untreated reference samples or foils treated in air-DBD. The Pd coverages achieved result in peel strengths of a copper metallization of up to 1.4 N · mm-1 .