Fraunhofer-Gesellschaft

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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Super Thin Flip Chip Assemblies on Flex Substrates - Adhesive Bonding and Soldering Technology - Reliability Investigations and Applications

 
: Haberland, J.; Pahl, B.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H.

International Microelectronics and Packaging Society -IMAPS-:
International Symposium on Microelectronics 2006. Proceedings : October 8 - 12, 2006, San Diego, California, USA
Washington, DC: IMAPS, 2006
ISBN: 0-930815-80-7
International Symposium on Microelectronics <39, 2006, San Diego/Calif.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-113438.html