Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Innovative approaches for realisation of embedded chip packages - technological challenges and achievements
| Institute of Electrical and Electronics Engineers -IEEE-:
IEEE 59th Electronic Components and Technology Conference, ECTC 2009. Vol.1 : San Diego, CA, USA, 26 - 29 May 2009
New York, NY: IEEE, 2009
ISBN: 978-1-4244-4475-5
pp.475-481 |
| Electronic Components and Technology Conference (ECTC) <59, 2009, San Diego/Calif.> |
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| English |
| Conference Paper |
| Fraunhofer IZM () |