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Innovative approaches for realisation of embedded chip packages - technological challenges and achievements

 
: Manessis, D.; Böttcher, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.

:

Institute of Electrical and Electronics Engineers -IEEE-:
IEEE 59th Electronic Components and Technology Conference, ECTC 2009. Vol.1 : San Diego, CA, USA, 26 - 29 May 2009
New York, NY: IEEE, 2009
ISBN: 978-1-4244-4475-5
pp.475-481
Electronic Components and Technology Conference (ECTC) <59, 2009, San Diego/Calif.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-113429.html