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Advanced failure analysis methods and microstructural investigations of wire bond contacts for current microelectronic system

: Klengel, R.; Bennemann, S.; Petzold, M.

International Microelectronics and Packaging Society -IMAPS-, Italian Chapter; Institute of Electrical and Electronics Engineers -IEEE-:
EMPC 2009, 17th European Microelectronics and Packaging Conference & Exhibition. CD-ROM : June 15th-18th, 2009 , Rimini, Italy
New York, NY: IEEE, 2009
ISBN: 0-615-29868-0
ISBN: 978-0-615-29868-9
ISBN: 978-1-4244-4722-0
European Microelectronics and Packaging Conference and Exhibition (EMPC) <17, 2009, Rimini>
Conference Paper
Fraunhofer IWM ()
wire bonding; reliability; failure analysis

The paper demonstrates that new failure modes can be analyzed and understood if an improved comprehensive flow in diagnostics involving non-destructive failure localization, ion-beam-supported target preparation, high-resolution electron microscopy and ultra-sensitive surface analytics are implemented in the physical failure analysis chain. For illustration, the potential of combining new non-destructive Lock-In-Thermography (LIT), 2D/3D-X-Ray inspec-tion and Scanning Acoustic Microscopy (SAM) to localize fine pitch wire bond failures inside moulded packages will be shown. In addition to non-destructive methods, the increasing demands related to current physics of failure approaches in reliability aspects require ultra-high-resolution microstructure investigations. Corrosive failing of the intermetal-lic Au4Al formed in the Au bond/Al pad contact is discussed. Results are presented based on preparation with Fo-cused Ion Beam (FIB) device followed by Scanning Electron Microscopy (SEM) and Transmission Electron Micros-copy (TEM) allowing analysing the corrosion process. Further application of Time-of-Flight Secondary Ion Mass Spectroscopy (ToF-SIMS) verified the presence of low concentrated contaminations as a root cause.