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PZT thick films for MEMS

: Gebhardt, S.; Partsch, U.; Schönecker, A.


Institute of Electrical and Electronics Engineers -IEEE-:
17th IEEE International Symposium on the Applications of Ferroelectrics 2008 : Santa Fe, New Mexico, 23 - 28 February 2008
New York, NY: IEEE, 2008
ISBN: 978-1-4244-2744-4
International Symposium on the Applications of Ferroelectrics (ISAF) <17, 2008, Santa Fe/NM>
Conference Paper
Fraunhofer IKTS ()

Al2O3, silicon and low temperature cofired ceramics (LTCC) are key functional materials, forming the substrate basis in microsystems technologies. They allow for three dimensional component integration, high robustness and excellent reliability. The combination of these substrate materials with piezoelectric films offer advanced sensor, actuator and ultrasonic transducer solutions which open up new fields of applications. We developed a PZT thick film paste with excellent dielectric and electromechanical properties. In combination with special electrode and barrier layers a technology was achieved allowing for the development of custom products.