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Solderjet bumping for the assembly of optical fibers

 
: Burkhardt, T.; Kamm, A.; Beckert, E.; Eberhardt, R.; Buchmann, F.; Tünnermann, A.

Fischer-Hirchert, U.H.P. ; Informationstechnische Gesellschaft -ITG-:
VII. ITG-Workshop Photonische Aufbau- und Verbindungstechnik 2009 : 7./8. Mai 2009, Wernigerode
Göttingen: Cuvillier, 2009 (Hochschule Harz, Lehrstuhl für Kommunikationstechnik 7)
ISBN: 978-3-86955-008-4
pp.42-46
Workshop Photonische Aufbau- und Verbindungstechnik <7, 2009, Wernigerode>
English
Conference Paper
Fraunhofer IOF ()
micro assembly; micro manipulation; micro-optical system integration; solder bumping; laser beam soldering; lead-free solder; LTCC; optical fiber

Abstract
Further miniaturization of 3D-integrated hybrid optical systems on smart system platforms requires a fast and flexible joining technology that overcomes limitations of standard bonding processes in optics. Laser-based solder bumping with its complete integration of solder alloy preform handling, reflowing and application of the solder volume simplifies the joining process and enables for flux-free soldering of micro-optical components with localized and time restricted energy input within a local nitrogen atmosphere. Solder joints provide increased mechanical strength, a higher long term, thermal and radiation stability and good thermal and electrical conductivity compared to polymeric adhesives commonly used for optical bonding. A demonstrator system of a fiber-coupling unit using a polarization maintaining optical fiber (PMF) that is soldered to a V-groove by solderjet bumping with submicron accuracy is described in this work. The development of a device for batch PVD-metallization of the fibers for the creation of necessary wetting surfaces and a miniaturized mechanical gripper enabling for both translational adjustment and the axial alignment of the fiber at the joining geometry is reported.

 

Further miniaturization of 3D-integrated hybrid optical systems on smart system platforms requires a fast and flexible joining technology that overcomes limitations of standard bonding processes in optics. Laser-based solder bumping with its complete integration of solder alloy preform handling, reflowing and application of the solder volume simplifies the joining process and enables for flux-free soldering of micro-optical components with localized and time restricted energy input within a local nitrogen atmosphere. Solder joints provide increased mechanical strength, a higher long term, thermal and radiation stability and good thermal and electrical conductivity compared to polymeric adhesives commonly used for optical bonding. A demonstrator system of a fiber-coupling unit using a polarization maintaining optical fiber (PMF) that is soldered to a V-groove by solderjet bumping with submicron accuracy is described in this work. The development of a device for batch PVD-metallization of the fibers for the creation of necessary wetting surfaces and a miniaturized mechanical gripper enabling for both translational adjustment and the axial alignment of the fiber at the joining geometry is reported.

: http://publica.fraunhofer.de/documents/N-110897.html