Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Nondestructive testing of damage layers in semiconductor materials by surface acoustic waves

 
: Schneider, D.; Stiehl, E.; Hammer, R.; Franke, A.; Riegert, R.; Schülke, T.

:

Starikov, A. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Design, process integration, and characterization for microelectronics : 6 - 7 March 2002, Santa Clara, USA
Bellingham/Wash.: SPIE, 2002 (SPIE Proceedings Series 4692)
ISBN: 0-8194-4439-1
pp.195-211
International Symposium on Advanced Microelectronic Manufacturing and Nanotechnologies <2002, Santa Clara/Calif.>
English
Conference Paper
Fraunhofer IWS ()
mechanische Schichtcharakterisierung; Laser-Akustik; Verformung; Festigkeit; Ultraschall

Abstract
Slicing semi-conductor wafers form ingots produces a damage layer that ha to be completely removed by complex polishing and etching processes. Nondestructively controlling the machining process is desirable. Laser induced surface acoustic waves are demonstrated to be a promising method to characterize the state of the surface.

: http://publica.fraunhofer.de/documents/N-10950.html