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Wafer Bumping for Wafer-Level CSPs and Flip Chips using Stencil Printing Technology

 

International Microelectronics and Packaging Society -IMAPS-:
12th European Microelectronics & Packaging Conference. Proceedings
1999
ISBN: 0-9535858-0-8
European Microelectronics & Packaging Conference <12, 1999, Harrogate>
English
Conference Paper
Fraunhofer IZM ()

Abstract
In this paper the experimental work of stencil printing for creating solder bumps on wafer-level CSP (CSP-WL) is described in detail. In the first part the basic process steps for wafer-level CSP's as well as for stencil printing are described. The second part shows the experimental work how maximum solder bump height can be achieved using stencil printing for a specific wafer-level CSP. Based on the experimental work the achieved bump height using conventional bumping methods and stencil printing are discussed.

: http://publica.fraunhofer.de/documents/N-109185.html