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On the quantification and improvement of the models for surface roughness

 
: Curran, B.; Ndip, I.; Guttowski, S.; Reichl, H.

:

Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
SPI 2009, 13th IEEE Workshop on Signal Propagation on Interconnects : May 12 - 15, 2009, Strasbourg, France; Workshop program
New York, NY: IEEE, 2009
ISBN: 978-1-4244-4490-8
4 pp.
Workshop on Signal Propagation on Interconnects (SPI) <13, 2009, Strasbourg>
German
Conference Paper
Fraunhofer IZM ()

Abstract
Predictability of transmission line parameters is very important for microelectronics packaging. Surface roughness can cause a drastic deviation in transmission line parameters from the ideal theoretically calculated values. State-of-the-art analytical and full-wave surface roughness models have been helpful in closing this gap but they have considerable limitations, especially when applied to certain types of thin-film structures. This work analyzes some state-of-the-art surface roughness models and quantifies their limitations. A new approach to surface roughness characterization is then presented.

: http://publica.fraunhofer.de/documents/N-109078.html