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"SECAP" International Advanced Packaging Consortium: Formed to Standardize Process Equipment for Wafer Level Packaging Technologies for 300mm

 
: Töpper, M.; Reichl, H.

Future fab international (2001), No.11
ISSN: 1363-5182
English
Journal Article
Fraunhofer IZM ()

Abstract
System integration and packaging are responsible for the functionality, quality and economy of microelectronic products. Due to this fact advances packaging technologies are now no longer the niche technologies they used to be in the past. it is clearly understood within the industry that electronic packaging has now become one of the critical enabling technologies for future IC generations.

: http://publica.fraunhofer.de/documents/N-108992.html