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2001
Conference Paper
Titel
High Density Bumping for Advanced Packaging
Titel Supplements
An Industrial View
Abstract
The paper will give an overview of electrochemically deposited (ECD) solder bumps (PbSn) as well as integration issues for ECD process flows. We will also discuss the automation of these processes to support high volume manufacturing. The paper will begin by discussing process challenges and how they can be overcome. Results will be presented based on a production tool installed at IZM, Berlin (200mm). These results will cover typical geometries (bump size and pitch) needed today and also discuss future requirements (e.g. 300mm wafer, smaller pitch). These results will include thickness and composition uniformity (within wafer, wafer to wafer). Cost of ownership will be discussed, focussing on a high volume manufacturing line. Limitations of current plating technologies and possible solutions will be discussed also.