Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

300mm Wafer Bumping: Printing Systems and Technologies

 
: Töpper, M.; Kloesner, J.; Kasulke, P.; Denise, O.; Myers, J.; Heyen, R.

International Microelectronics and Packaging Society -IMAPS-:
Topical Workshop and Exhibition on Flip Chip Technology 2002. Technical Presentations : CD-ROM
2002
Topical Workshop and Exhibition on Flip Chip Technology <2002, Austin>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-108796.html