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High speed (greater-than 100 Gbps) key components for a scalable optical data link to be implemented in future maskless lithography applications

: Paraskevopoulos, A.; Voss, S.-H.; Talmi, M.; Walf, G.


Behringer, U.F.W. ; VDE/VDI-Gesellschaft Mikroelektronik, Mikro- und Feinwerktechnik -GMM-:
25th European Mask and Lithography Conference : 12 - 15 January 2009, Dresden, Germany
Bellingham, WA: SPIE, 2009 (SPIE Proceedings 7470)
ISBN: 978-0-8194-7770-5
Art. 747011, 8 pp.
European Mask and Lithography Conference (EMLC) <25, 2009, Dresden>
Conference Paper
Fraunhofer HHI ()
electron beam lithography; BICMOS integrated circuits; integrated optoelectronics; optical receiver

Maskless lithography based on electron beam parallelization requires well adapted data links, capable of transmitting the corresponding data volume at rates up to the Tbps domain. In this paper we focus on two key components, the high-speed data buffer unit and the integrated optical receiver, which are part of a scalable (24 - 140 Gbps) optical data link. The high-speed buffer design architecture enables the transmission of skew-compensated parallel data in the range of 50 Gbps. The 45-channel low-noise integrated optical receiver chip based on BiCMOS 0.6 micron technology is capable of an overall transmission capacity of 140 Gbps.