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Modeling and analysis of return-current paths for microstrip-to-microstrip via transitions

: Ndip, I.; Ohnimus, F.; Guttowski, S.; Reichl, H.

DOI: 10.1109/ESTC.2008.4684546

	Institute of Electrical and Electronics Engineers -IEEE-: 2nd Electronics Systemintegration Technology Conference, ESTC 2008. Proceedings. Vol.2 : 1st - 4th September 2008, Greenwich, London, UK Piscataway, NJ: IEEE, 2008 ISBN: 978-1-4244-2813-7 ISBN: 978-1-4244-2814-4 ISBN: 1-4244-2813-0 pp.1321-1326
	Electronics Systemintegration Technology Conference (ESTC) <2, 2008, London>

	English
	Conference Paper
	Fraunhofer IZM ()

Abstract
In this contribution, the return-current paths for single-ended microstrip-to-microstrip via transitions in conventional layer stack-ups are modeled and analyzed. Electromagnetic Reliability (EMR) problems which occur in these layer stack-ups, because the return-currents are not properly managed are discussed. Finally, a layer stack-up with well defined return-current paths, which overcomes the limitations of traditional layer stack-ups, is proposed.

: http://publica.fraunhofer.de/documents/N-106575.html