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Kuehlkoerper und Verfahren zur Herstellung eines Kuehlkoerpers

Heat sink for cooling electronic device, has body provided with structures for increasing heat-dissipating surface, and mounting portion provided with lug to heat-transfer portion that is inserted in thermal vias of printed circuit board
 
: März, M.; Tchobanov, D.; Eckardt, B.; Zeltner, S.; Egelkraut, S.; Amesoeder, S.

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Frontpage ()

DE 102007057533 A: 20071129
DE 102007057533 A: 20071129
H05K0007
H01L0023
German
Patent, Electronic Publication
Fraunhofer IISB ()

Abstract
(A1) Ein Kuehlkoerper umfasst einen Grundkoerper aus einem elektrisch isolierenden Material und ein oder mehrere metallische Formteile mit einem Befestigungsabschnitt und einem Waermetransport-Abschnitt, wobei der Waermetransport-Abschnitt mit dem Grundkoerper mechanisch verbunden ist. Eine Platine mit mehreren Waermequellen, die auf unterschiedlichen elektrischen Potenzialen sein koennen, kann mit dem Kuehlkoerper bestueckt werden, wobei die Befestigungsabschnitte der Formteile mit jeweiligen Waermequellen oder in der Naehe der jeweiligen Waermequellen verloetet werden.

 

US 20090139690 A1 UPAB: 20090619 NOVELTY - The sink has a conductive base body (1) provided with structures for increasing a heat-dissipating surface. A metallic molded part including a mounting portion mounted to a heat source. A heat-transfer portion e.g. pin, of the molded part is made of an electrically insulating material e.g. ceramic, and the body is insulated from the molded part. The mounting portion is protruded from the body, and is provided with a lug (3) extending in an angle with regard to the heat-transfer portion that is inserted in a thermal vias of a printed circuit board (10) e.g. surface mount device (SMD). DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for the following: (1) a method for producing a heat sink (2) a method for inserting a heat source on a printed circuit board. USE - Heat sink for cooling an electronic device. ADVANTAGE - The sink improves the heat dissipation by increasing surface of the conductive base body, so that the heat dissipation can take place both via convection to liquid/gaseous cooling medium by radiation. The base body of the insulating material achieves heat dissipation to the environment without short circuits. The heat sink can be produced in a cost-effective manner, and allows simultaneous cooling of different electronic devices that are at different electrical potentials, by using a single cooling element.

: http://publica.fraunhofer.de/documents/N-106478.html