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Verfahren und Vorrichtung zur Bearbeitung von Waferoberflaechen

Method for processing wafer surfaces in the production of solar cells comprises inserting wafers into a treatment chamber, contacting with an alkaline treatment solution containing a texturing agent and further processing
 
: Mayer, K.; Schumann, M.; Kray, D.; Orellana Peres, T.; Rentsch, J.; Zimmer, M.

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Frontpage ()

DE 102007058876 A: 20071206
DE 102007058876 A: 20071206
H01L0021
C23F0001
H01L0031
German
Patent, Electronic Publication
Fraunhofer ISE ()

Abstract
(A1) Die Erfindung betrifft ein Verfahren zur Bearbeitung von Waferoberflaechen, umfassend eine simultane Reinigung, Schadensaetzung und Texturierung von Waferoberflaechen. Ebenso betrifft die Erfindung eine Vorrichtung zur simultanen Reinigung, Schadensaetzung und Texturierung von Waferoberflaechen. Dies betrifft insbesondere monokristalline Siliziumwafer zur Solarzellenherstellung.

 

DE 102007058876 A1 UPAB: 20090619 NOVELTY - Method for processing wafer surfaces comprises inserting wafers into a treatment chamber, contacting with an alkaline treatment solution containing a texturing agent and continuously transporting the solution along at least one surface of the wafers in the form of a liquid film which wets the surface. DETAILED DESCRIPTION - Preferred Features: The wafers are fixed in basins using holders and the treatment solution is transported in the basins along the surface of the wafer in the form of a liquid film which wets the surface. Several wafers are stacked in the basins. The wafers are fixed in a horizontal manner. USE - Method for processing wafer surfaces in the production of solar cells. ADVANTAGE - Damage to the wafer surfaces is avoided.

: http://publica.fraunhofer.de/documents/N-106469.html