Options
2008
Conference Paper
Titel
Pb-free conductor gold paste for AlN-ceramic
Abstract
This work shows the results of the development of a lead-oxide free conductor paste consisting of gold as main electrically conductive component. Gold paste has to be optimized by alloying-elements (Ag, Pd) for improving the wire bondability. Two groups of gold pastes with different alloying elements (Au/Ag and Au/Pd) were prepared and compared. Investigations of resistance, adhesion (Sebastian Pull Test) and surface were use to characterise the sinter behaviour. The results clearly show differences in resistivity, porosity and adhesion between these two groups. Furthermore the wire bondability of the final paste was determined.