Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Electrochemical Cu deposition in sub-100-nm interconnects

Results for a new model
: Liske, R.; Preusse, A.; Wehner, S.; Kücher, P.; Bartha, J.W.

Naik, M. ; Materials Research Society -MRS-; Univ. of California, Continuing Education in Engineering:
Advanced Metallization Conference, AMC 2008 : Proceedings of the conference held September 23 - 25, 2008, San Diego, California, USA and October 8 - 10, 2008, at the University of Tokyo, Tokyo, Japan
Warrendale, Pa.: MRS, 2008
ISBN: 978-1-605-11125-4
Advanced Metallization Conference (AMC) <25, 2008, San Diego/Calif.>
Advanced Metallization Conference Asian Session (ADMETA) <18, 2008, Tokyo>
Conference Paper
Fraunhofer CNT ()