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The effect of a copper buffer on interface defeat

 
: Holmquist, T.J.; Anderson, C.E.; Behner, T.

Bless, S. ; National Defense Industrial Association -NDIA-, Ballistics Division; International Ballistics Committee -IBC-:
24th International Symposium on Ballistics. Proceedings. Vol. 2: Terminal ballistics, warhead mechanisms, vulnerability, wound ballistics : New Orleans, Louisiana, September 22 - 26, 2008
Lancaster, Pa.: DEStech Publications, 2008
ISBN: 978-1-932078-93-0
pp.721-728
International Symposium on Ballistics <24, 2008, New Orleans/La.>
English
Conference Paper
Fraunhofer EMI ()

: http://publica.fraunhofer.de/documents/N-101974.html