Fundamental investigations for residual stress measurements in the micrometer range by means of the correlation of magnetic quantities to experimentally determined stress-strain fields

Increasing miniaturization of micromechanic and microelectronic components has directed intensified attention to residual stress measurements with high lateral resolutions. The fundamentals for a quantitative method to measure residual stresses in the micrometer range, which is less timeconsuming and less expensive than X-ray methods, was developed within the framework of a DFG research program. For the first time, the Barkhausen Noise Eddy Current Microscope (BEMI) offers a powerful testing technique that can be used (adequate calibration provided) for non-contact, high-resolution residual stress measurements in the micrometer (µm) range.