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Measurement of the local strength distribution of directly bonded silicon wafers using the micro-chevron-test

 
: Bagdahn, J.; Petzold, M.; Plößl, A.; Wiemer, M.

Hunt, C.E. ; Electrochemical Society -ECS-, Electronics Division:
Semiconductor wafer bonding. Science, technology, and applications V : Proceedings of the international symposia
Pennington: Electrochemical Society, 2001 (Electrochemical Society. Proceedings 99-35)
ISBN: 1-566-77258-3
pp.218-223
International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications <5, 1999, Honolulu/Hawaii>
English
Conference Paper
Fraunhofer IWM ()
Fraunhofer ENAS ()

: http://publica.fraunhofer.de/documents/B-90315.html