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Lifetime properties of wafer-bonded components under static and cyclic loading
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2001
Conference Paper
Titel
Lifetime properties of wafer-bonded components under static and cyclic loading
Author(s)
Bagdahn, J.
Petzold, M.
Hauptwerk
Semiconductor wafer bonding. Science, technology, and applications V
Konferenz
International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications 1999
Language
English
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Fraunhofer-Institut für Werkstoffmechanik IWM