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Wafer conserving full range construction analysis for IC fabrication and process development based on FIB/dual beam inline application

 
: Boit, C.; Dawes, N.; Dziesiaty, A.; Demm, E.; Ebersberger, B.; Frey, L.; Geyer, S.; Hirsch, A.; Lehrer, C.; Meis, P.; Kamolz, M.; Lezec, H.; Rettenmaier, H.; Tittes, W.; Treichler, R.; Weiland, R.; Zimmermann, H.

Electronic Device Failure Analysis Society -EDFAS-, Materials Park/Ohio:
26th International Symposium for Testing and Failure Analysis 2000. Proceedings : 12 - 16 November 2000, Meydenbauer Convention Center, Bellevue, Washington
Materials Park, Ohio: ASM International, 2000
ISBN: 0-87170-701-2
pp.393-396
International Symposium for Testing and Failure Analysis (ISTFA) <26, 2000, Bellevue/Wash.>
English
Conference Paper
Fraunhofer IIS B ( IISB) ()

: http://publica.fraunhofer.de/documents/B-90023.html