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Advanced multi-wire slicing according to "both direction" machining kinematics

 
: Klocke, F.; Huttenhuis, S.; Pähler, D.; Vojtechovsky, K.

Weck, M. ; European Society for Precision Engineering and Nanotechnology -EUSPEN-; Fraunhofer-Institut für Produktionstechnologie -IPT-, Aachen; Physikalisch-Technische Bundesanstalt -PTB-, Braunschweig:
EUSPEN International Topical Conference on Precision Engineering, Micro Technology, Measurement Techniques and Equipment 2003. Proceedings. Vol.1 : May 19th - 20th, 2003, Aachen, Germany
Voerde: Riehm, 2003
ISBN: 3-926832-30-4
pp.333-336
International Topical Conference on Precision Engineering, Micro Technology, Measurement Techniques and Equipment <2003, Aachen>
English
Conference Paper
Fraunhofer IPT ()
wafer silicon; lapping; Wire

Abstract
The Multi-Wire Slicing (MWS) technique is successfully introduced in the mass production of plane workpieces such as wafers due to its high productivity. With increasing demands on the wafer's quality, especially with regard to the rising wafer diameters, the existing MWS-technique has to be improved. One promising new approach, the »Both Direction« (BD) machining principle, is proposed.

: http://publica.fraunhofer.de/documents/B-89956.html