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Investigation of indium solder interfaces for high-power diode lasers

: Scholz, C.; Boucke, K.; Poprawe, R.


Zediker, M.S. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
High-power diode laser technology and applications : 27 - 28 January 2003, San Jose, California, USA
Bellingham, WA: SPIE, 2003 (Proceedings of SPIE 4973)
ISBN: 0-8194-4773-0
Conference "High-Power Diode Laser Technology and Applications" <2003, San Jose/Calif.>
Conference Paper
Fraunhofer ILT ()
high-power diode laser; indium; reduction; solder interface

In order to optimize the soldering process of laserbars onto heatsinks with Indium solder, several investigations have been made. First the growth of the Indium oxide film is examined.
With this knowledge four different reduction methods are selected. Formic acid as a wet chemical reduction, a plasma activated Hydrogen/Argon gas, a gas enriched with formic acid, and a protective layer of Gold were investigated and compared for an optimized reduction of the oxide film of the Indium solder.
A cross section of the solder interface after the soldering process is made in order to see the distribution of the metals. High diffusion of the solder with its contact partners is a sign of a good connection. Enough pure Indium has to be available after the soldering process in order to use its creek properties to reduce the mechanical stress in the laserbar.