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Eco-analysis of wafer level bumping

 
: Schischke, K.; Griese, H.; Müller, J.

Reichl, H.:
Micro System Technologies 2001 : International Conference & Exhibition on Micro-Electro-, -Opto-, -Mechanical Systems and Components, Düsseldorf, March 27 - 29, 2001
Berlin: VDE-Verlag, 2001
ISBN: 3-8007-2601-7
pp.125-130
International Conference on Micro-, Electro-, Opto-, Mechanical Systems and Components <2001, Düsseldorf>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/B-82735.html