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Copper metallization scheme for vertical chip integration

 
: Riedel, S.; Ecke, R.; Schulz, S.E.; Gessner, T.; Wieland, R.; Leutenecker, R.; Klumpp, A.; Ramm, P.

Zhang, S.-L.:
Materials for advanced metallization. Proceedings of the Fifth European Workshop on Materials for Advanced Metallization : Sigtuna, Sweden, March 5 - 7, 2001
Amsterdam: Elsevier, 2002 (Microelectronic engineering 60.2001,1/2)
European Workshop on Materials for Advanced Metallization (MAM) <5, 2001, Sigtuna>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/B-82733.html