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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Processing design rules for reliable reflowable underfill application

 
: Kallmayer, C.; Becker, K.-F.; Jung, E.; Aschenbrenner, R.; Reichl, H.

Electronic Components, Assemblies, and Materials Association; Components, Packaging and Manufacturing Technology Society -CPMT-:
ECTC 2001. Proceedings of the 51st Electronic Components & Technology Conference
Orlando/FL: Piscataway, 2001
ISBN: 0-7803-7040-6
Electronic Components and Technology Conference (ECTC) <51, 2001,Orlando/Fla.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/B-82622.html