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Development of an assembly process and reliability investigations for flip chip LEDs using AuSn soldering

: Elger, G.; Hutter, M.; Oppermann, H.H.; Aschenbrenner, R.; Reichl, H.; Jäger, E.


Microsystem Technologies 7 (2002), No.5-6, pp.239-243
ISSN: 0946-7076
International Conference on Micro-, Electro-, Opto-, Mechanical Systems and Components <2001, Düsseldorf>
Journal Article, Conference Paper
Fraunhofer IZM ()

A packaging process for flip-chip LEDs (light emitting diodes) is described. The LEDs are picked and placed on a silicon substrate wafer. After reflow the substrates are individualized. AuSn solder is used for the interconnection. The solder compounds, Au and Sn, are electroplated separately: Sn on the silicon substrate and Au on the chip. The interconnections formed by tin-rich and by gold-rich intermetallic phases are compared. The metallurgy and the reliability of the LEDs are investigated. The superiority of the gold-rich interconnection is demonstrated.