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Studies on parameters for popcorn cracking

 
: Dudek, R.; Walter, H.; Michel, B.; Alpern, P.; Schmidt, R.; Tilgner, R.

:

Institute of Electrical and Electronics Engineers -IEEE-; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Polytronic 2001, International Conference on Polymers and Adhesives in Microelectronics and Photonics. Proceedings
New York, NY: IEEE, 2001
ISBN: 0-7803-7220-4
pp.140-148
International Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic) <1, 2001, Potsdam>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/B-82321.html