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  4. Parametrized models for a RF chip-to-substrate interconnect
 
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2001
Conference Paper
Title

Parametrized models for a RF chip-to-substrate interconnect

Author(s)
Doerr, I.
Hwang, L.-T.
Sommer, G.
Opermann, H.
Li, L.
Petras, M.
Korf, S.
Sahli, F.
Myers, T.
Miller, M.
John, W.
Mainwork
ECTC 2001. Proceedings of the 51st Electronic Components & Technology Conference  
Conference
Electronic Components and Technology Conference (ECTC) 2001  
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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