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Copper alloy formation and film properties after annealing of Al/Cu stacks in different ambients
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2002
Journal Article
Titel
Copper alloy formation and film properties after annealing of Al/Cu stacks in different ambients
Author(s)
Chen, Z.
Richter, K.
Riedel, S.
Schulz, S.E.
Gessner, T.
Zeitschrift
Microelectronic engineering
DOI
10.1016/S0167-9317(01)00584-6
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM