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Advanced flip chip encapsulation: Transfer molding process for simultaneous underfiling and postencapsulation

 
: Becker, K.-F.; Braun, T.; Koch, M.; Ansorge, F.; Aschenbrenner, R.; Reichl, H.

:

Institute of Electrical and Electronics Engineers -IEEE-; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Polytronic 2001, International Conference on Polymers and Adhesives in Microelectronics and Photonics. Proceedings
New York, NY: IEEE, 2001
ISBN: 0-7803-7220-4
pp.130-139
International Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic) <1, 2001, Potsdam>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/B-82310.html