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Interfacial fracture toughness tests suited for reliability enhancements of advanced plastic packages

 
: Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B.

:

Institute of Electrical and Electronics Engineers -IEEE-; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Polytronic 2001, International Conference on Polymers and Adhesives in Microelectronics and Photonics. Proceedings
New York, NY: IEEE, 2001
ISBN: 0-7803-7220-4
pp.155-158
International Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic) <1, 2001, Potsdam>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/B-82306.html