Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Plastic encapsulation technologies - Processes and characterization
| Institute of Electrical and Electronics Engineers -IEEE-; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Polytronic 2001, International Conference on Polymers and Adhesives in Microelectronics and Photonics. Proceedings
New York, NY: IEEE, 2001
ISBN: 0-7803-7220-4 |
| International Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic) <1, 2001, Potsdam> |
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| English |
| Conference Paper |
| Fraunhofer IZM () |