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Plastic encapsulation technologies - Processes and characterization
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2001
Conference Paper
Titel
Plastic encapsulation technologies - Processes and characterization
Author(s)
Ansorge, F.
Becker, K.-F.
Braun, T.
Jung, E.
Misawa, D.
Hauptwerk
Polytronic 2001, International Conference on Polymers and Adhesives in Microelectronics and Photonics. Proceedings
Konferenz
International Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic) 2001
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM