Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Constitution behaviour of lead-free solders vs. lead-containing solders - Experiments on bulk specimens and flip-chip joints
| Electronic Components, Assemblies, and Materials Association; Components, Packaging and Manufacturing Technology Society -CPMT-:
ECTC 2001. Proceedings of the 51st Electronic Components & Technology Conference
Orlando/FL: Piscataway, 2001
ISBN: 0-7803-7040-6
pp.890-902 |
| Electronic Components and Technology Conference (ECTC) <51, 2001,Orlando/Fla.> |
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| English |
| Conference Paper |
| Fraunhofer IZM () |