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Constitution behaviour of lead-free solders vs. lead-containing solders - Experiments on bulk specimens and flip-chip joints

 
: Wiese, S.; Schubert, A.; Walter, H.; Dudek, R.; Meusel, E.; Michel, B.

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Electronic Components, Assemblies, and Materials Association; Components, Packaging and Manufacturing Technology Society -CPMT-:
ECTC 2001. Proceedings of the 51st Electronic Components & Technology Conference
Orlando/FL: Piscataway, 2001
ISBN: 0-7803-7040-6
pp.890-902
Electronic Components and Technology Conference (ECTC) <51, 2001,Orlando/Fla.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/B-79735.html