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  4. Electro-thermal circuit simulation using simulator coupling
 
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1997
Journal Article
Title

Electro-thermal circuit simulation using simulator coupling

Abstract
The paper presents a methodology for simulating the static and dynamic performance of integrated circuits in the presence of electro-thermal interactions on the integrated circuit die. The technique is based on the coupling of a finite element method (FEM) program with a circuit simulator. In difference to other known simulator couplings a time step algorithm is used. Its implementation into simulation tools is described. The thermal modeling of the die/package structure and the extended modeling of the electronic circuit is discussed. Simulation results which indicate the capabilities of the methodology for electro-thermal simulation are compared to experimental results.
Author(s)
Wünsche, S.
Clauß, C.
Schwarz, P.
Winkler, F.
Journal
IEEE transactions on very large scale integration (VLSI) systems  
DOI
10.1109/92.609870
Language
English
Fraunhofer-Institut für Integrierte Schaltungen IIS  
Keyword(s)
  • circuit simulation

  • finite element simulation

  • simulator coupling

  • thermal

  • modeling

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