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Strength assessment of wafer-bonded micromechanical components using the micro-chevron-test

 
: Petzold, M.; Knoll, H.; Bagdahn, J.

:

Ramesham, R. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Reliability, Testing, and Characterization of MEMS and MOEMS Conference : 22 - 24 October 2001, San Francisco, USA
Bellingham/Wash.: SPIE, 2001 (SPIE Proceedings Series 4558)
ISBN: 0-8194-4286-0
pp.133-142
Reliability, Testing, and Characterization of MEMS and MOEMS Conference <2001, San Francisco/Calif.>
English
Conference Paper
Fraunhofer IWM ()

: http://publica.fraunhofer.de/documents/B-74640.html