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Qualification of the system electroless nickel bumps and PbSn5 for high temperature applications

 
: Anhöck, S.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.

Morris, J.E. ; International Microelectronics and Packaging Society -IMAPS-:
International Symposium on Advanced Packaging Materials 2001. Proceedings : Processes, Properties and Interfaces : Chateau Elan, Braselton, Georgia, March 11 - 14, 2001
Washington, DC: IMAPS, 2001
ISBN: 0-930815-64-5
pp.102-106
International Symposium on Advanced Packaging Materials <7, 2001, Braselton/Ga.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/B-73760.html