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Interface fracture investigations on micro components

 
: Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B.

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Fulltext (PDF; )

Materials Week 2000. Proceedings
Frankfurt: Werkstoffwoche-Partnerschaft GbRmbH, 2000
8 pp.
Materials Week <2000, München>
Werkstoffwoche <3, 2000, München>
English
Conference Paper, Electronic Publication
Fraunhofer IZM ()

Abstract
The increasing application of advanced electronic packages under harsh environmental conditions, extreme temperatures especially in automotive applications is often a reason for damage, fatigue and failure of entire components and systems. Consequently, their thermo-mechanical reliability is one of the most important preconditions for adopting these technologies in industrial applications. Therefore, integrated circuits are usually encapsulated into packages in order to prevent chips from being exposed to the external environment. As a result, a microelectronic package is basically a rakish compound of several materials with quite different Young's moduli and thermal expansion coefficients. Additionally, various kinds of inhomogeneity, residual stresses from several steps of the manufacturing process contribute to interface delaminations, chip cracking and fatigue of solder interconnects. This paper intends to describe the investigation of damage and interface delamination phenomena in micro components by using combined numerical investigations by means of FEA and experimental investigations. It explains how experimental data were used as input for the quantitative evaluation of fatigue and fracture of microcomponents.

: http://publica.fraunhofer.de/documents/B-73631.html