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A new approach for system integrated packaging

 
: Aschenbrenner, R.; Jung, E.; Ostmann, A.; Landesberger, C.; Reichl, H.

Lim, T.B.:
3rd Electronics Packaging Technology Conference (EPTC 2000). Proceedings : 5 - 7 December 2000, Sheraton Towers, Singapore
Piscataway, NJ: IEEE Order Department, 2000
ISBN: 0-7803-6644-1
ISBN: 0-7803-6645-X
Electronics Packaging Technology Conference (EPTC) <3, 2000, Singapore>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/B-73630.html