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  4. Surface oxide films on aluminum bondpads: Influence on thermosonic wire bonding behavior and hardness
 
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2000
Journal Article
Title

Surface oxide films on aluminum bondpads: Influence on thermosonic wire bonding behavior and hardness

Abstract
Using indentation testing, wire bond tests and electron microscopy, the influence of increased oxide films on Al metallization surfaces on the wire bonding behavior and hardness was investigated. Oxide film thickness values larger than about 20 nm obstruct the bond contact and resulted in a poor bonding quality. The presence of such films causes also a hardness increase which can be detected by current sensitive indentation test methods. Therefore, an improved indentation testing technique can be applied during the quality control of bondpad metallizations prior to wire bonding.
Author(s)
Petzold, M.
Berthold, L.
Katzer, D.
Knoll, H.
Memhard, D.
Meier, P.
Lang, K.-D.
Journal
Microelectronics reliability  
DOI
10.1016/S0026-2714(00)00130-X
Language
English
Fraunhofer-Institut für Werkstoffmechanik IWM  
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