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Surface oxide films on aluminum bondpads: Influence on thermosonic wire bonding behavior and hardness

 
: Petzold, M.; Berthold, L.; Katzer, D.; Knoll, H.; Memhard, D.; Meier, P.; Lang, K.-D.

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Microelectronics reliability 40 (2000), No.8-10, pp.1515-1520
ISSN: 0026-2714
English
Journal Article
Fraunhofer IWM ()

Abstract
Using indentation testing, wire bond tests and electron microscopy, the influence of increased oxide films on Al metallization surfaces on the wire bonding behavior and hardness was investigated. Oxide film thickness values larger than about 20 nm obstruct the bond contact and resulted in a poor bonding quality. The presence of such films causes also a hardness increase which can be detected by current sensitive indentation test methods. Therefore, an improved indentation testing technique can be applied during the quality control of bondpad metallizations prior to wire bonding.

: http://publica.fraunhofer.de/documents/B-68200.html