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  4. Lifetime investigations of directly wafer-bonded samples under static and cyclic loading
 
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2000
Conference Paper
Title

Lifetime investigations of directly wafer-bonded samples under static and cyclic loading

Abstract
Strength and fatigue tests were performed to investigate the reliability properties of Si wafer-bonded samples exposed to static or cyclic mechanical loading. A distinct strength decrease with increasing loading duration or load cycle number, respectively was found limiting the lifetime of mechanically stressed wafer bonded components. As a consequence, loaded wafer-bonded sensors and actuators may suddenly fail during application. Appropriate fracture mechanical approaches can be applied to predict the lifetime behavior for a given loading situation and, therefore, to provide a high reliability of micromechanical devices.
Author(s)
Bagdahn, J.
Petzold, M.
Sommer, E.
Mainwork
MicroMat 2000. Proceedings 3rd International Conference and Exhibition Micro Materials  
Conference
Micro Materials (Micro Mat) 2000  
Language
English
Fraunhofer-Institut für Werkstoffmechanik IWM  
Keyword(s)
  • silicon

  • wafer bonding

  • static loading

  • cyclic loading

  • lifetime

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