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Flip chip solder joint reliability

 

APACK '99. Symposium on Advances in Packaging. Proceedings
Singapore, 1999
ISBN: 981-04-2078-1
pp.234-242
Symposium on Advances in Packaging (APACK) <1999, Singapore>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/B-63083.html