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MicroDAC deformation analysis on solder interconnects for flip chip

 
: Vogel, D.; Luczak, F.; Schubert, A.; Michel, B.

Agonafer, D. ; American Society of Mechanical Engineers -ASME-, Electrical and Electronic Packaging Division:
Advances in electronic packaging 1999. Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference. Vol.2
New York, NY: ASME, 1999 (EEP 26,2)
ISBN: 0-7918-1612-5
pp.1309-1316
Pacific Rim ASME International Intersociety Electronic and Photonic Packaging Conference (Interpack) <1999, Maui/Hawaii>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/B-63057.html