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MicroDAC deformation analysis on solder interconnects for flip chip
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1999
Conference Paper
Title
MicroDAC deformation analysis on solder interconnects for flip chip
Author(s)
Vogel, D.
Luczak, F.
Schubert, A.
Michel, B.
Mainwork
Advances in electronic packaging 1999. Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference. Vol.2
Conference
Pacific Rim ASME International Intersociety Electronic and Photonic Packaging Conference (Interpack) 1999
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
