Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Materials mechanics and thermo-mechanical reliability of flip chip area array packages

 
: Schubert, A.; Dudek, R.; Michel, B.

Agonafer, D. ; American Society of Mechanical Engineers -ASME-, Electrical and Electronic Packaging Division:
Advances in electronic packaging 1999. Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference. Vol.1
New York, NY: ASME, 1999 (EEP 26,1)
ISBN: 0-7918-1612-5
pp.181-187
Pacific Rim ASME International Intersociety Electronic and Photonic Packaging Conference (Interpack) <1999, Maui/Hawaii>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/B-63046.html