Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Materials mechanics and thermo-mechanical reliability of flip chip area array packages
| Agonafer, D. ; American Society of Mechanical Engineers -ASME-, Electrical and Electronic Packaging Division:
Advances in electronic packaging 1999. Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference. Vol.1
New York, NY: ASME, 1999 (EEP 26,1)
ISBN: 0-7918-1612-5
pp.181-187 |
| Pacific Rim ASME International Intersociety Electronic and Photonic Packaging Conference (Interpack) <1999, Maui/Hawaii> |
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| English |
| Conference Paper |
| Fraunhofer IZM () |