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Packaging and thermomechanical challenges for high temperature electronics
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1999
Conference Paper
Titel
Packaging and thermomechanical challenges for high temperature electronics
Author(s)
Michel, B.
Vogel, D.
Hauptwerk
HITEN '99. The Third European Conference on High Temperature Electronics. Proceedings
Konferenz
European Conference on High Temperature Electronics (HITEN) 1999
DOI
10.1109/HITEN.1999.827463
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM